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Our Equipment Diamond Wire Wafer Cutting and Slicing

Large Equipment Slicing Grinding Equipment

Sliced parts coming off our wire saws have surface finishes that very often reduce or eliminate additional machining operations, such as grinding or lapping. Our key strengths are our large installed base of Wire Saws and ID Saws, our in house processing of Wire Guide Rolls and our 40 years of wafer slicing.

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